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NVIDIA Vera Rubin / variant

NVL576 Ultra

576 Rubin Ultra GPUs in a single rack at ~600 kW. First NVIDIA system shipping with co-packaged optics (CPO) NVSwitch, replacing pluggable transceivers. Densest AI training pod NVIDIA has shipped.

Cooling
liquid
Optics
cpo
Form factor
rack
TDP
600 kW
Process
TSMC N3P
Launch
2027 H2

出貨量預估

區間 + 信心水準 + 來源；不同分析師、不同時點的預估會並列。

期間出貨量 (low–mid–high)ASP (USD)信心來源
2027 H250–200–40028.00MrumorCPO ecosystem timing
2028 FY300–800–1.5k26.00MrumorCPO ecosystem timing

Server-level BOM

每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。

Compute

GPU / CPU dies — the headline silicon.

2 項零組件
$23.6M–$38.6M
  • Rubin Ultra GPU diegating

    Top-bin Rubin (likely 2x reticle), full HBM stack allocation.

    ×576 die· silicon· 90 g· $40k–$65k / unit
    100%
    100%
  • Vera CPU diegating

    88-core Vera CPU.

    ×288 die· silicon· 50 g· $2.0k–$4.0k / unit
    100%
    100%

Memory

HBM stacks attached to the compute die.

1 項零組件
$3.2M–$5.5M
  • HBM4 stack (16-Hi)gating

    Top-bin 16-Hi HBM4; supply is the gating factor.

    ×4608 stack· DRAM· 6 g· $700–$1.2k / unit
    70%
    20%
    10%

Packaging & Substrate

Advanced packaging (CoWoS-L) + ABF substrate.

2 項零組件
$173k–$288k
  • CoWoS-L interposergating

    NVL576 absorbs a large share of TSMC CoWoS-L 2027 capacity.

    ×576 interposer· silicon· 4 g
    100%
  • ABF substrategating
    ×576 substrate· ABF film· 35 g· $300–$500 / unit
    50%
    30%
    20%

Cooling

Cold plate, CDU, hoses, manifolds.

3 項零組件
$415k–$687k
  • Liquid cold plate (GPU)gating

    High-performance copper cold plate, 600W+ per die.

    ×576 piece· copper· 380 g· $200–$360 / unit
    30%
    25%
    25%
    20%
  • CDU (ultra-density)gating

    600 kW rack; multiple CDUs feed a single rack.

    ×2 unit· steel + aluminum· 130.0 kg· $150k–$240k / unit
    60%
    40%
  • Manifold + immersion-ready piping
    ×1 set· stainless + EPDM· 22.0 kg
    尚無供應商

Power

PSUs, busbars, BBU.

2 項零組件
$35k–$60k
  • PSU 12 kWgating

    600 kW rack needs higher density PSU shelves.

    ×50 unit· 6.5 kg· $700–$1.2k / unit
    50%
  • 54 V busbar (heavy)
    ×4 unit· copper· 18.0 kg
    尚無供應商

Networking

NICs, switches, cables, CPO modules.

3 項零組件
$1.5M–$2.5M
  • CPO NVSwitch (silicon photonics)gating

    NVL576 ships with co-packaged optics NVSwitch — first NVIDIA system to do so. Replaces pluggable transceivers.

    ×144 unit· 8.2 kg· $8.0k–$14k / unit
    35%
    35%
    15%
    15%
  • ConnectX-9 NICgating
    ×576 card· 180 g· $550–$900 / unit
    100%
  • Optical fiber assembly

    Single-mode optical fiber + connectors between CPO modules.

    ×2300 piece· glass· 8 g
    100%
    50%
    50%

Chassis & Mechanical

Rack, sleds, trays, brackets, heatsink fins.

2 項零組件
$18k–$28k
  • Rack enclosure (extra-deep, reinforced)
    ×1 unit· steel· 280.0 kg· $18k–$28k / unit
    50%
    30%
  • Compute sled tray
    ×72 piece· aluminum· 7.2 kg
    50%
    30%

Board / Backplane / BMC

Motherboard, backplane, BMC, signal integrity.

2 項零組件
$40–$80
  • BMC management chip
    ×1 chip· silicon· 6 g· $40–$80 / unit
    95%
  • Backplane (high-speed)gating
    ×1 board· 14.0 kg
    尚無供應商