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NVIDIA Vera Rubin / variant

Vera Rubin NVL72

72 Rubin GPUs + 36 Vera CPUs in one liquid-cooled rack. 3.6 EFLOPS FP4, 20.7 TB HBM4, 260 TB/s NVLink-6. Mainstream Rubin rack.

Cooling
liquid
Optics
copper
Form factor
rack
TDP
100 kW
Process
TSMC N3P
Launch
2026 H2

出貨量預估

區間 + 信心水準 + 來源；不同分析師、不同時點的預估會並列。

期間出貨量 (low–mid–high)ASP (USD)信心來源
2026 H21.5k–2.5k–4.0k3.50MlowTrendForce 2026-04
2027 FY8.0k–12k–18k3.30MmediumTrendForce + Reuters 2026

Server-level BOM

每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。

Compute

GPU / CPU dies — the headline silicon.

2 項零組件
$2.2M–$3.7M
  • Rubin GPU diegating

    Dual-die reticle design on TSMC N3P (3nm-class).

    ×72 die· silicon· 90 g· $30k–$50k / unit
    100%
    100%
  • Vera CPU diegating

    NVIDIA Arm-based CPU (Grace successor), 88-core class.

    ×36 die· silicon· 50 g· $2.0k–$4.0k / unit
    100%
    100%

Memory

HBM stacks attached to the compute die.

1 項零組件
$346k–$576k
  • HBM4 stackgating

    16-Hi HBM4 stacks attached to each Rubin GPU.

    ×576 stack· DRAM· 6 g· $600–$1.0k / unit
    60%
    25%
    15%

Packaging & Substrate

Advanced packaging (CoWoS-L) + ABF substrate.

2 項零組件
$18k–$32k
  • CoWoS-L interposergating

    TSMC Chip-on-Wafer-on-Substrate with Local interconnect.

    ×72 interposer· silicon· 4 g
    100%
  • ABF substrategating

    Ajinomoto Build-up Film substrate carrying the CoWoS-L stack.

    ×72 substrate· ABF film· 35 g· $250–$450 / unit
    50%
    30%
    20%

Cooling

Cold plate, CDU, hoses, manifolds.

3 項零組件
$93k–$163k
  • Liquid cold plate (GPU)gating

    Copper micro-channel cold plate per GPU module.

    ×72 piece· copper· 350 g· $180–$320 / unit
    30%
    25%
    25%
    20%
  • Coolant Distribution Unit (CDU)gating

    In-row CDU, single-phase warm-water DLC at 45°C.

    ×1 unit· steel + aluminum· 80.0 kg· $80k–$140k / unit
    60%
    40%
  • Quick-connect liquid hose

    EPDM hose with dripless QDC fittings.

    ×96 piece· EPDM + brass· 220 g
    尚無供應商

Power

PSUs, busbars, BBU.

2 項零組件
$5k–$8k
  • PSU 5.5 kWgating

    Titanium-rated PSU, 54 V output, hot-swap.

    ×12 unit· 4.5 kg· $400–$700 / unit
    50%
  • Busbar assembly

    54 V DC busbar feeding 18 compute trays.

    ×2 unit· copper· 12.0 kg
    尚無供應商

Networking

NICs, switches, cables, CPO modules.

3 項零組件
$112k–$191k
  • NVLink-6 switch traygating

    NVLink Switch ASIC + retimers + copper cabling, 1.8 TB/s per port.

    ×18 unit· 6.5 kg· $4.0k–$7.0k / unit
    100%
    50%
  • ConnectX-9 / BlueField NICgating

    800 Gb/s SerDes, ConnectX-9 generation.

    ×72 card· 180 g· $550–$900 / unit
    100%
  • Copper NVLink cable

    Passive copper cable for intra-rack NVLink (NVL72 uses copper, not optics).

    ×1296 piece· copper· 35 g
    100%

Chassis & Mechanical

Rack, sleds, trays, brackets, heatsink fins.

3 項零組件
$8k–$14k
  • Rack enclosure

    21" OCP-derived rack frame, 1.5 m deep.

    ×1 unit· steel· 180.0 kg· $8.0k–$14k / unit
    50%
    30%
    20%
  • Compute sled tray

    Aluminum sled holding 2× GPU + 1× CPU.

    ×18 piece· aluminum· 6.5 kg
    50%
    30%
    20%
  • Heat-sink mass (Cu fins)

    Auxiliary aluminum fin stack on cold plate return.

    ×18 piece· copper + aluminum· 1.2 kg
    尚無供應商

Board / Backplane / BMC

Motherboard, backplane, BMC, signal integrity.

2 項零組件
$40–$80
  • BMC + management chip

    Aspeed AST2700-class BMC, OCP DC-SCM module.

    ×1 chip· silicon· 6 g· $40–$80 / unit
    95%
  • Compute carrier board

    High-layer-count PCB carrying GPU + HBM stack.

    ×18 board· 4.5 kg
    尚無供應商