AMD · 2026-2027
AMD Instinct MI400 Series
AMD's next-generation AI accelerator family unveiled at CES 2026: TSMC N2 logic with potential partial shift to Samsung Foundry SF2P (decision early 2026), CoWoS-L 3.5D packaging, 432 GB HBM4 per GPU, and rack-scale liquid cooling via the Helios open-rack architecture (built on Meta 2025 OCP design). Available across three accelerator SKUs (MI430X for sovereign/HPC, MI440X for server training+inference, MI455X for rack-scale). Helios rack: 72× MI455X + 18× EPYC Venice CPUs delivering 2.9 EFLOPS FP4.
主要 variants
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AMD Instinct MI450
2026 H2Server-scale MI450 accelerator (UBB8 8-GPU baseboard). 432 GB HBM4 per GPU, 19.6 TB/s HBM bandwidth, 20 PFLOPS FP8 / 40 PFLOPS FP4. Oracle named as 50,000-GPU launch customer for 2026 (Tom's Hardware).
AMD Instinct MI455X (Helios Rack)
2027 H1Rack-scale Helios UALoE72 system: 72× MI455X + 18× EPYC Venice CPUs across 18 compute trays in a double-wide open rack (~7000 lb, Meta OCP 2025 design). 31 TB HBM4 total, 1.4 PB/s aggregate bandwidth, 2.9 EFLOPS FP4 / 1.4 EFLOPS FP8. Networking via AMD Pensando Vulcano 800 NIC + Salina 400 DPU. Engineering samples H2 2026; mass production Q2 2027.