AMD Instinct MI400 Series / variant
AMD Instinct MI450
Server-scale MI450 accelerator (UBB8 8-GPU baseboard). 432 GB HBM4 per GPU, 19.6 TB/s HBM bandwidth, 20 PFLOPS FP8 / 40 PFLOPS FP4. Oracle named as 50,000-GPU launch customer for 2026 (Tom's Hardware).
出貨量預估
區間 + 信心水準 + 來源;不同分析師、不同時點的預估會並列。
| 期間 | 出貨量 (low–mid–high) | ASP (USD) | 信心 | 來源 |
|---|---|---|---|---|
| 2026 H2 | 30k–50k–70k | 0.02M | rumor | Tom's Hardware (Oracle 50k deployment 2026) |
Server-level BOM
每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。
Compute
GPU / CPU dies — the headline silicon.
- MI450 GPU diegating
CDNA 5 architecture, TSMC N2 logic, 20 PFLOPS FP8 / 40 PFLOPS FP4 per die.
×8 die· silicon· $18k–$28k / unit100%100% - EPYC Venice CPU
AMD Zen 6 server CPU (host), TSMC N2 class.
×1 die· silicon· $4.0k–$8.0k / unit100%100%
Memory
HBM stacks attached to the compute die.
- HBM4 stackgating
12-stack 432 GB total per GPU, 19.6 TB/s aggregate bandwidth.
×96 stack· silicon· $280–$360 / unit50%35%15%
Packaging & Substrate
Advanced packaging (CoWoS-L) + ABF substrate.
- CoWoS-L 3.5D interposergating
TSMC CoWoS-L 3.5D advanced packaging for GPU + HBM4 stacks.
×8 package· silicon· $2.5k–$4.0k / unit100% - ABF substrate
High-layer-count ABF substrate for OAM module.
×8 substrate· organic· $320–$480 / unit45%35%20%
Cooling
Cold plate, CDU, hoses, manifolds.
- Liquid cold plate (distributed)
Independent cold plate + flexible hose per GPU and HBM4 stack; thermal density >1200 W per accelerator.
×8 assembly· copper· $150–$220 / unit30%25%25%20%
Networking
NICs, switches, cables, CPO modules.
- Pensando Vulcano 800 AI NIC
AMD in-house 800 Gb/s AI NIC (Pensando division).
×8 card· silicon· $600–$900 / unit100% - Pensando Salina 400 DPU
AMD in-house 400 Gb/s DPU for management plane.
×1 card· silicon· $500–$750 / unit100%
Board / Backplane / BMC
Motherboard, backplane, BMC, signal integrity.
- BMC
Baseboard management controller for AI server tray.
×1 chip· silicon· $8–$14 / unit95%