weilabweilab
Sign in

AMD Instinct MI400 Series / variant

AMD Instinct MI455X (Helios Rack)

Rack-scale Helios UALoE72 system: 72× MI455X + 18× EPYC Venice CPUs across 18 compute trays in a double-wide open rack (~7000 lb, Meta OCP 2025 design). 31 TB HBM4 total, 1.4 PB/s aggregate bandwidth, 2.9 EFLOPS FP4 / 1.4 EFLOPS FP8. Networking via AMD Pensando Vulcano 800 NIC + Salina 400 DPU. Engineering samples H2 2026; mass production Q2 2027.

Cooling
liquid
Optics
copper
Form factor
rack
TDP
145 kW
Process
TSMC N2
Launch
2027 H1

出貨量預估

區間 + 信心水準 + 來源；不同分析師、不同時點的預估會並列。

期間出貨量 (low–mid–high)ASP (USD)信心來源
2027 H15.0k–15k–30k0.03MrumorIndustry reports (mass production Q2 2027)

Server-level BOM

每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。

Compute

GPU / CPU dies — the headline silicon.

2 項零組件
$1.7M–$2.4M
  • MI455X GPU diegating

    Top-of-stack MI400-series die, TSMC N2. 20 PFLOPS FP8 / 40 PFLOPS FP4. 72 GPUs per Helios rack.

    ×72 die· silicon· $22k–$32k / unit
    100%
    100%
  • EPYC Venice CPU

    AMD Zen 6 host CPU, one per compute tray (18 trays × 1 CPU).

    ×18 die· silicon· $4.0k–$8.0k / unit
    100%
    100%

Memory

HBM stacks attached to the compute die.

1 項零組件
$242k–$311k
  • HBM4 stackgating

    12 stacks per GPU × 72 GPUs = 864 stacks; 31 TB total HBM4, 1.4 PB/s aggregate bandwidth.

    ×864 stack· silicon· $280–$360 / unit
    50%
    35%
    15%

Packaging & Substrate

Advanced packaging (CoWoS-L) + ABF substrate.

2 項零組件
$203k–$323k
  • CoWoS-L 3.5D interposergating

    TSMC CoWoS-L 3.5D for each MI455X die + HBM4 stacks.

    ×72 package· silicon· $2.5k–$4.0k / unit
    100%
  • ABF substrate

    High-layer-count ABF substrate for OAM module.

    ×72 substrate· organic· $320–$480 / unit
    45%
    35%
    20%

Cooling

Cold plate, CDU, hoses, manifolds.

1 項零組件
$13k–$19k
  • Distributed liquid cold plate + flexible hose

    Distributed cooling layout (independent cold plate + flexible hose) on each GPU and HBM4 stack; extends to DIMMs. Designed for >1200 W heat density per accelerator.

    ×72 assembly· copper· $180–$260 / unit
    30%
    25%
    25%
    20%

Power

PSUs, busbars, BBU.

1 項零組件
$14k–$25k
  • Rack PSU + PDU

    Liquid-cooled rack power architecture, ~145 kW per rack (estimated from 72×1.2 kW + overhead).

    ×18 module· mixed· $800–$1.4k / unit
    55%
    45%

Networking

NICs, switches, cables, CPO modules.

3 項零組件
$102k–$168k
  • Pensando Vulcano 800 AI NIC

    AMD Pensando 800 Gb/s AI NIC, one per MI455X.

    ×72 card· silicon· $600–$900 / unit
    100%
  • Pensando Salina 400 DPU

    AMD Pensando 400 Gb/s DPU for management plane.

    ×18 card· silicon· $500–$750 / unit
    100%
  • UALink scale-up fabricgating

    UALoE72 scale-up fabric across 72 GPUs in one rack; 3.6 TB/s scale-up bandwidth per GPU.

    ×1 fabric· mixed· $50k–$90k / unit
    100%
    50%
    50%

Chassis & Mechanical

Rack, sleds, trays, brackets, heatsink fins.

1 項零組件
$12k–$20k
  • Helios open rack

    Double-wide open-rack chassis based on Meta 2025 OCP design; ~7000 lb fully populated.

    ×1 rack· metal· $12k–$20k / unit
    50%
    30%
    20%

Board / Backplane / BMC

Motherboard, backplane, BMC, signal integrity.

1 項零組件
$144–$252
  • BMC

    Baseboard management controller per compute tray.

    ×18 chip· silicon· $8–$14 / unit
    95%