Google Tensor Processing Unit / variant
Ninth-gen TPU; codename Humufish; expected to migrate packaging to Intel EMIB to relieve CoWoS-S capacity bottlenecks [4][9]. Broadcom supply contract through 2031 [7] anchors v9 timing around 2029. Specs not publicly disclosed.
區間 + 信心水準 + 來源；不同分析師、不同時點的預估會並列。
| 期間 | 出貨量 (low–mid–high) | ASP (USD) | 信心 | 來源 |
|---|---|---|---|---|
| 2029 FY | 500k–2000k–5000k | 0.02M | rumor | Trendforce 2026-05-11 + BigGo 2026-04-28 |
每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。
GPU / CPU dies — the headline silicon.
Process node not yet public; Broadcom + MediaTek likely.
HBM stacks attached to the compute die.
HBM4 likely given 2029 timeline but not confirmed.
Advanced packaging (CoWoS-L) + ABF substrate.
Embedded multi-die interconnect bridge; replaces CoWoS for v9.
