SpaceX Starlink / variant
Next-gen, revealed 2025-10-13. ~2,000 kg, ~1 Tbps downlink and ~200 Gbps uplink per satellite; ~60 V3 sats per Starship launch add ~60 Tbps to the network (>20× a V2 Mini Falcon 9 launch) [1]. Ku/Ka/E-band; first operational deliveries targeted for 2026 [1].
區間 + 信心水準 + 來源；不同分析師、不同時點的預估會並列。
| 期間 | 出貨量 (low–mid–high) | ASP (USD) | 信心 | 來源 |
|---|---|---|---|---|
| 2026 (ramp) | —–—–— | — | low | Tom's Hardware 2025-10-13 |
每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。
GPU / CPU dies — the headline silicon.
Star-tracker + GPS-based guidance; in-house avionics.
RF/mixed-signal chips co-designed with STM; STM confirms use in latest V3 [3].
PSUs, busbars, BBU.
Larger deployable solar array to feed 1 Tbps payload [1].
Argon-fueled Hall-effect thruster (2nd-gen) [2].
In-house battery + power conditioning.
NICs, switches, cables, CPO modules.
衛星測控（遙測/追蹤/命令）RF 模組。
Higher-capacity phased arrays — 1 Tbps downlink / 200 Gbps uplink per sat [1].
衛星 RF 收發模組。
E-band gateway/backhaul on Gen3 [2].
In-house optical terminals; higher-rate backhaul on V3 [1][2].
Rack, sleds, trays, brackets, heatsink fins.
~2,000 kg bus, Starship-class — >3× a V2 Mini [1].
Motherboard, backplane, BMC, signal integrity.
衛星用 HDI + 射頻 PCB；超高頻、高可靠度。
