公司

Primary CDU + reference cooling architecture partner.

AI server + motherboard maker; named in NVIDIA''s Vera Rubin full-production partner roster (Computex 2026).

High-core-count optical fiber cassette + RF/optical passive components supplier; 2025 revenue NT$10.5B (+64% YoY), gross margin 57.7%. ~90% revenue from US CSPs (Google / Microsoft / Meta / Amazon / Anthropic), 75% customized. Through <30% stake in subsidiary 合聖, in qualification stage for CPO active light source (ELS) + fiber array unit (FAU); target 2026 mass production but not yet shipping. Manufacturing in Taiwan / Philippines / China / Europe.

CPO laser + transceivers; NVIDIA $2B investment 2026-03.

Finnish networking equipment maker. NVIDIA invested $1B in Oct-2025 (2.90% stake) to co-develop AI-RAN and 6G via the NVIDIA Arc Aerial RAN Computer platform. 2026 Q1 AI+cloud net sales YoY +49%; CAGR guide raised from 16% to 27% through 2028. Also supplies data-center routers/switches to Microsoft Azure and CoreSite.

Top-3 global notebook ODM. Tangential RTX Spark beneficiary — likely contract-builds RTX Spark notebooks for branded OEMs, but no public source names Compal for RTX Spark specifically (industry inference).

全球 MLCC 第三、chip resistor 第一、鉭電容第一；產線涵蓋 MLCC / 鉭電容 / 鋁電容（透過子公司凱美）/ chip resistor。2026/02 領漲台灣被動元件、外資 5/14 目標價 495 元，AI 伺服器高階 MLCC + TLVR 雙紅利。

PC brand. Named as an RTX Spark partner "expected to follow" the initial Fall-2026 launch wave (Computex 2026).

Notebook + AI server ODM. Tangential RTX Spark beneficiary — plausible contract ODM, not source-confirmed for RTX Spark (industry inference).

Gaming + AI PC brand/ODM. RTX Spark launch OEM (e.g. MSI Prestige N16 Flip AI laptop); also builds RTX Spark desktop systems shown at Computex 2026.

NTC 熱敏電阻 / 過電流保護元件全球前段；AI 伺服器 / EV 電池管理 BMS 應用受惠。

台灣 power inductor 龍頭，已於 2019 年起被國巨集團納入（國巨持股逾 50%）；切入 AI server VRM TLVR 電感用量（每台 AI 伺服器需 5–10 顆 TLVR、ASP 為一般電感 3–5 倍）。