companies
每家公司有自己的詳細頁，含 BOM 反向查 / 題材歸屬 / 股價 / 估值 / 財報 / 新聞。排序依 BOM 列數 + 題材數加權，常出現在前面。
2330.TWSole foundry for Rubin (N3P process) and CoWoS-L packaging.
SPACEXPrivate. Designs and manufactures the Starlink satellite bus, Ku/Ka/E-band phased-array antennas, optical inter-satellite laser terminals and Hall-effect thrusters in-house (Redmond, WA). Vertically integrated — discloses no satellite BOM or supplier shares [2].
2308.TWPSU + named cold plate supplier; thermal heritage.
NVDAGPU + platform designer. Owns the Rubin spec and DGX brand.
AMDGPU + CPU designer. Owns the MI400/MI450 series spec, Pensando NIC/DPU silicon, and the Helios open-rack reference architecture.
2382.TWODM; Rubin rack assembly + NVLink board.
3017.TWNamed cold plate supplier for Vera Rubin (DigiTimes 2026-03-18).
3324.TWOCold plate + thermal module; ASUS partner.
3037.TWABF substrate top supplier.
000660.KSHBM4 lead supplier for Rubin; primary partner since HBM3e.
3491.TWO高頻微波與毫米波元件廠（UMT）；已開發並出貨低軌衛星 TT&C（測控）與 ISL（衛星間鏈路）產品，台灣「血統最純」低軌衛星供應商 [3]。
INTCEMIB advanced packaging supplier for Google's v9 Humufish (and 8e variant) — alternative to TSMC CoWoS-S; supplies Xeon + IPU for Google AI DC infra.