companies
每家公司有自己的詳細頁，含 BOM 反向查 / 題材歸屬 / 股價 / 估值 / 財報 / 新聞。排序依 BOM 列數 + 題材數加權，常出現在前面。
MUHBM4 third source; smaller share but qualified.
STMFranco-Italian semiconductor maker; SpaceX's clearest external Starlink silicon partner. Co-designed RF/mixed-signal chips — 5B+ shipped over a decade, used in millions of user terminals and 10,000+ Starlink satellites incl. V3; slated to supply upcoming inter-satellite laser-link chips [3][4].
005930.KSHBM4 supplier (secondary); diversifying after losing 2024 lead.
2317.TWLargest ODM for NVL72; system integrator + cabling.
2454.TWLead designer for cost-optimized inference TPUs (v7e, v8i Zebrafish, v9 Humufish) and I/O-die + back-end design service for the training TPU 8t Sunfish [3].
3665.TWCable assemblies for AI servers + CPO connector ecosystem.
AVGOTomahawk / Jericho CPO switch silicon competitor; named in CPO ecosystem.
GLWOptical fiber for CPO; NVIDIA $3.2B deal 2026-05.
009150.KSSamsung 集團旗下 PCB / 元件子公司；Intel 玻璃基板雙領跑者之一，2026-04 進入 pre-mass production phase [2]。Samsung 集團內玻璃載板由 SEMCO 主導（非母公司 Samsung Electronics）。
3231.TWODM; tray + sub-assembly.
VRTPrimary CDU + reference cooling architecture partner.
2301.TW全球電源供應器大廠，AI／雲端電能管理（power shelf、BBU）為成長主軸 — 雲端物聯網部門占營收 56% [鉅亨, 2026-06-09]，AI 產品營收占比 2025 約 2 成、2026 目標 3 成 [經濟日報, 2026-06-03]