companies
每家公司有自己的詳細頁，含 BOM 反向查 / 題材歸屬 / 股價 / 估值 / 財報 / 新聞。排序依 BOM 列數 + 題材數加權，常出現在前面。
8255.TWO全球最大車用整流二極體廠，市佔超過5成 [元大, 2025-10-22]；Bosch 退出後承接市佔，轉進 MHEV 48V MOSFET 模組與高壓 SiC 模組封測 [經濟日報, 2026-06-04]。
LITECPO laser + transceivers; NVIDIA $2B investment 2026-03.
NOKFinnish networking equipment maker. NVIDIA invested $1B in Oct-2025 (2.90% stake) to co-develop AI-RAN and 6G via the NVIDIA Arc Aerial RAN Computer platform. 2026 Q1 AI+cloud net sales YoY +49%; CAGR guide raised from 16% to 27% through 2028. Also supplies data-center routers/switches to Microsoft Azure and CoreSite.
2324.TWTop-3 global notebook ODM. Tangential RTX Spark beneficiary — likely contract-builds RTX Spark notebooks for branded OEMs, but no public source names Compal for RTX Spark specifically (industry inference).
2353.TWPC brand. Named as an RTX Spark partner "expected to follow" the initial Fall-2026 launch wave (Computex 2026).
2356.TWNotebook + AI server ODM. Tangential RTX Spark beneficiary — plausible contract ODM, not source-confirmed for RTX Spark (industry inference).
2377.TWGaming + AI PC brand/ODM. RTX Spark launch OEM (e.g. MSI Prestige N16 Flip AI laptop); also builds RTX Spark desktop systems shown at Computex 2026.
2472.TW鋁電容（含固態 / 高分子鋁電容）利基廠；伺服器電源端用量隨 AI 機櫃功耗放大受惠。
3016.TW矽磊晶 / 高階高壓 SiC 磊晶片（第三代半導體上游）；800VDC SiC 滲透長線受惠 [經濟日報, 2026-06-04]。題材 tangential（材料層，不直接供 rack）。
3026.TW利基型 MLCC 廠，跨足車用 / 工控 / 醫療 / 軍規高階特殊規格，避開消費型紅海競爭。
3105.TWOGaAs 砷化鎵晶圓代工龍頭（Win Semiconductors）；星鏈衛星已採用其晶片 [1]，2026 年成長動能含低軌衛星通訊與航太軍工。
3308.TWCPU/GPU sockets + high-speed connectors.