companies
每家公司有自己的詳細頁，含 BOM 反向查 / 題材歸屬 / 股價 / 估值 / 財報 / 新聞。排序依 BOM 列數 + 題材數加權，常出現在前面。
APHCable + connector for NVLink copper interconnect.
GOOGDesigner of the TPU programme; co-architects v7p/v8t/v8i and v9 with Broadcom + MediaTek; Cloud Next 2026 split TPU into training (8t) and inference (8i) SKUs.
HPEFirst major ODM partner publicly adopting AMD Helios rack architecture for 2026 AI systems (Tom's Hardware).
2449.TWTaiwan testing house (FT + burn-in); TPU 8t/8i final test partner per supply-chain reports.
6510.TWOProbe card supplier; benefits from advanced-node ASIC test demand including Google TPU.