NVIDIA RTX Spark / variant
N1X superchip in thin (down to 14 mm) premium Windows laptops. 20-core (10+10) Arm + Blackwell 6,144-CUDA GPU, 128 GB unified LPDDR5X, 1 PFLOP FP4, >=40 TOPS NPU. 30+ models from ASUS / Dell / HP / Lenovo / Microsoft / MSI, Fall 2026.
區間 + 信心水準 + 來源；不同分析師、不同時點的預估會並列。
每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。
GPU / CPU dies — the headline silicon.
Blackwell GPU chiplet, 6,144 CUDA cores (desktop RTX 5070-class), 1 PFLOP FP4, Copilot+ (>=40 TOPS) NPU. 18-core SKU pairs a 5,120-CUDA cut. [3][4]
20 custom Arm cores (10+10) built by MediaTek; CPU + I/O chiplet linked to GPU chiplet by ~600 GB/s silicon bridge. [1][3]
HBM stacks attached to the compute die.
Up to 128 GB unified LPDDR5X, ~300 GB/s bandwidth shared CPU+GPU. [2][3]
Cold plate, CDU, hoses, manifolds.
Thin-laptop (down to 14 mm) vapor-chamber thermal solution for 45-80 W envelope. [3][5]
PSUs, busbars, BBU.
45-80 W platform power; battery + power-management for premium thin notebook. [3]
Rack, sleds, trays, brackets, heatsink fins.
CNC chassis + system integration; laptops as thin as 14 mm. [3][5]
Motherboard, backplane, BMC, signal integrity.
High-density-interconnect mainboard carrying the N1X SoC + LPDDR5X.
M.2 NVMe storage.
