公司

Sole foundry for Rubin (N3P process) and CoWoS-L packaging.

Private. Designs and manufactures the Starlink satellite bus, Ku/Ka/E-band phased-array antennas, optical inter-satellite laser terminals and Hall-effect thrusters in-house (Redmond, WA). Vertically integrated — discloses no satellite BOM or supplier shares [2].

PSU + named cold plate supplier; thermal heritage.

GPU + platform designer. Owns the Rubin spec and DGX brand.

Franco-Italian semiconductor maker; SpaceX's clearest external Starlink silicon partner. Co-designed RF/mixed-signal chips — 5B+ shipped over a decade, used in millions of user terminals and 10,000+ Starlink satellites incl. V3; slated to supply upcoming inter-satellite laser-link chips [3][4].

GPU + CPU designer. Owns the MI400/MI450 series spec, Pensando NIC/DPU silicon, and the Helios open-rack reference architecture.

ODM; Rubin rack assembly + NVLink board.

Named cold plate supplier for Vera Rubin (DigiTimes 2026-03-18).

Cold plate + thermal module; ASUS partner.

ABF substrate top supplier.

Primary CDU + reference cooling architecture partner.

HBM4 lead supplier for Rubin; primary partner since HBM3e.