公司

Copper-clad laminate (CCL) leader. Rubin-gen mix shifts to high-margin M9 for backplane/switch tray + high-volume M8.5 for UBB/compute tray; described as the first/only M9-certified supplier (CTEE / Goldman Sachs, 2026-01).

InP / GaAs epitaxial-wafer maker for optical comms. Led Taiwan semiconductor revenue-growth rankings on CPO momentum: +76.2% YoY cumulative to NT$1.97bn through Nov 2025 (Digitimes/TechNews).

Optical passive components / fiber-connector maker; named in the Wiwynn CPO optical scale-up rack Taiwan ecosystem (UDN 經濟日報, Computex 2026).

Fiber-array / optical-connector maker for CPO light engines; named in the Wiwynn CPO optical scale-up rack Taiwan ecosystem (UDN 經濟日報, Computex 2026).

Compound-semiconductor MBE epitaxy. +53.8% YoY (NT$0.97bn) through Nov 2025; share-swap (5.1:1) with optical-component maker EZconn/光聖 (6442) to deliver end-to-end silicon-photonics CPO from epi growth to module integration.

High-core-count optical fiber cassette + RF/optical passive components supplier; 2025 revenue NT$10.5B (+64% YoY), gross margin 57.7%. ~90% revenue from US CSPs (Google / Microsoft / Meta / Amazon / Anthropic), 75% customized. Through <30% stake in subsidiary 合聖, in qualification stage for CPO active light source (ELS) + fiber array unit (FAU); target 2026 mass production but not yet shipping. Manufacturing in Taiwan / Philippines / China / Europe.

Cable + connector for NVLink copper interconnect.

Designer of the TPU programme; co-architects v7p/v8t/v8i and v9 with Broadcom + MediaTek; Cloud Next 2026 split TPU into training (8t) and inference (8i) SKUs.

First major ODM partner publicly adopting AMD Helios rack architecture for 2026 AI systems (Tom's Hardware).

Taiwan testing house (FT + burn-in); TPU 8t/8i final test partner per supply-chain reports.

高彈性模數低熱膨脹特種膠膜 (Balance Film) 解翹曲；玻璃基板貼合材料 (耐高溫低收縮)；2025 Q4 毛利 64.86% 創高 [4]；已切入 TSMC 供應鏈做先進封裝晶背研磨 / 雷射解膠 / 探針清潔片等耗材 [4]。

甲酸真空回焊爐：透過真空環境消除氣泡，與山太士 (3595) 的特種膠膜方案互補形成翹曲控制生態鏈 [3]。