companies
Each company has its own page with reverse BOM lookup, theme membership, price, valuation, earnings and news. Ranked by BOM rows + theme count, so the most-connected show up first.
8086.TWOGaAs 砷化鎵晶圓代工廠（AWSC）；PA / LNA 射頻化合物半導體，低軌衛星通訊潛在受惠（直接 LEO 出貨佐證較弱）。
8163.TWNTC / 特殊被動元件 + 鍵盤 + 電源模組；台達電集團相關。被動元件漲價題材中受惠度待法說會確認。
ARMBritish CPU IP licensor. NVIDIA tried to acquire ARM 2020-2022 (deal blocked); retained equity stake post-IPO. Vera CPU on Rubin platform is Arm-based — direct architectural dependency.
CRWVAI-specialized hyperscaler. NVIDIA holds 47.21M shares ($3.66B at Q1-2026), NVDA's second-largest disclosed stake. Runs NVIDIA GPU fleets for hyperscaler customers; benefits from Rubin generation rollout.
NBISDutch AI-cloud provider (Yandex spin-off). NVIDIA stake ~$123M at Q1-2026. Operates GPU clusters across EU for AI training; emerging CoreWeave-style customer of Rubin generation.
SIE.DEIndustrial automation, electrification, and digital-twin supplier. Siemens announced DSX infrastructure reference architectures spanning medium/low-voltage power, automation, and physics-based digital twins for Rubin DSX. [8]
SNPSLeading EDA vendor (chip-design software + IP). NVIDIA Q1-2026 13F disclosed stake. Synopsys tools are used to design Rubin, Vera CPU, and ConnectX-9 NIC silicon — strategic supplier on the design side.
SU.PAEnergy management and automation supplier. NVIDIA lists Schneider Electric among DSX ecosystem contributors providing simulation-ready electrical-equipment assets for AI factories. [3]
TTThermal-management and HVAC supplier. NVIDIA lists Trane among DSX contributors; Trane is optimizing thermal management for gigawatt-scale AI factories. [3]
TXN類比 + 電源管理 + GaN/Si power stage 大廠；最新季營收約 $4.825B、年增約19%，車用與工業端「瘋狂加單」，提早備料。
1815.TWOLow-Dk glass-cloth maker. 據傳 passed 台光電 certification as a second Low-Dk2 glass-cloth source (after Japan''s Nittobo) for Rubin-gen CCL; 雲林虎尾 + Thailand capacity expansion. RUMOR-grade attribution per CTEE 2026-01-17.
2383.TWCopper-clad laminate (CCL) leader. Rubin-gen mix shifts to high-margin M9 for backplane/switch tray + high-volume M8.5 for UBB/compute tray; described as the first/only M9-certified supplier (CTEE / Goldman Sachs, 2026-01).