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NVIDIA Vera Rubin / variant

Vera Rubin NVL144 CPX

Prefill-optimized rack with 144 GPUs. 8 EFLOPS, 100 TB fast memory, 1.7 PB/s aggregate memory bandwidth. Paired with NVL72 racks for decode.

Cooling
liquid
Optics
copper
Form factor
rack
TDP
180 kW
Process
TSMC N3P
Launch
2027 H1

出貨量預估

區間 + 信心水準 + 來源;不同分析師、不同時點的預估會並列。

期間出貨量 (low–mid–high)ASP (USD)信心來源
2027 H1500–1.2k–2.0k5.50MrumorInferred from NVIDIA roadmap
2027 FY1.5k–3.0k–5.0k5.30MrumorInferred from NVIDIA roadmap

Server-level BOM

每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。

Compute

GPU / CPU dies — the headline silicon.

2 項零組件
$4.5M–$7.5M
  • Rubin CPX GPU diegating

    Tuned Rubin variant with prefill-tuned compute / memory ratio.

    ×144 die· silicon· 90 g· $30k–$50k / unit
    99%
    NV
    NVDA
    NVIDIA
    $205.10
    -6.20%
    99%
23
2330.TW
台積電
NT$2,295
-2.96%
  • Vera CPU diegating

    88-core Vera CPU.

    ×72 die· silicon· 50 g· $2.0k–$4.0k / unit
    99%
    NV
    NVDA
    NVIDIA
    $205.10
    -6.20%
    99%
    23
    2330.TW
    台積電
    NT$2,295
    -2.96%
  • Memory

    HBM stacks attached to the compute die.

    1 項零組件
    $806k–$1.3M
    • HBM4 stackgating

      Higher capacity HBM4 for prefill (16-Hi 36-48 GB stacks).

      ×1152 stack· DRAM· 6 g· $700–$1.1k / unit
      99%
      00
      005930.KSalt
      Samsung Electronics
      ₩295,500
      -10.18%
      99%
      00
      000660.KS
      SK Hynix
      ₩1,911,000
      -7.68%
      99%
      MU
      MUalt
      Micron Technology
      $864.01
      -13.25%

    Packaging & Substrate

    Advanced packaging (CoWoS-L) + ABF substrate.

    2 項零組件
    $36k–$65k
    • CoWoS-L interposergatingtgv-process-equipmenttgv-glass-substrate
      ×144 interposer· silicon· 4 g
      99%
      23
      2330.TW
      台積電
      NT$2,295
      -2.96%
    • ABF substrategatingtgv-process-equipmenttgv-glass-substrate
      ×144 substrate· ABF film· 35 g· $250–$450 / unit
      99%
      49
      4958.Talt
      Ibiden
      ¥3,105
      +1.47%
      99%
      30
      3037.TW
      欣興
      NT$911.00
      -2.36%
      99%
      AT
      ATS.VIalt
      AT&S
      €131.00
      -1.65%

    Cooling

    Cold plate, CDU, hoses, manifolds.

    2 項零組件
    $136k–$226k
    • Liquid cold plate (GPU)gating
      ×144 piece· copper· 350 g· $180–$320 / unit
      99%
      23
      2308.TWalt
      台達電
      NT$2,255
      -1.96%
      99%
      36
      3653.TW
      健策
      NT$3,820
      +5.52%
      99%
      33
      3324.TWOalt
      雙鴻
      NT$1,095
      -1.35%
      99%
      30
      3017.TW
      奇鋐
      NT$2,570
      -1.15%
    • CDU (high-density)gating
      ×1 unit· steel + aluminum· 110.0 kg· $110k–$180k / unit
      99%
      23
      2308.TWalt
      台達電
      NT$2,255
      -1.96%
      99%
      VR
      VRT
      Vertiv Holdings
      $300.51
      -7.23%

    Power

    PSUs, busbars, BBU.

    1 項零組件
    $10k–$17k
    • PSU 8 kWgatingpassive-components-price-hike-2026
      ×18 unit· 5.8 kg· $550–$950 / unit
      99%
      23
      2308.TW
      台達電
      NT$2,255
      -1.96%

    Networking

    NICs, switches, cables, CPO modules.

    2 項零組件
    $223k–$382k
    • NVLink-6 switch traygating
      ×36 unit· 6.5 kg· $4.0k–$7.0k / unit
      99%
      NV
      NVDA
      NVIDIA
      $205.10
      -6.20%
    • ConnectX-9 NICgatingai-networking-optical
      ×144 card· 180 g· $550–$900 / unit
      99%
      NV
      NVDA
      NVIDIA
      $205.10
      -6.20%

    Chassis & Mechanical

    Rack, sleds, trays, brackets, heatsink fins.

    1 項零組件
    $9k–$16k
    • Rack enclosure (deeper)
      ×1 unit· steel· 220.0 kg· $9.0k–$16k / unit
      99%
      23
      2382.TWalt
      廣達
      NT$376.50
      -3.59%
      99%
      23
      2317.TW
      鴻海
      NT$269.50
      -5.27%

    Board / Backplane / BMC

    Motherboard, backplane, BMC, signal integrity.

    1 項零組件
    $40–$80
    • BMC management chip
      ×1 chip· silicon· 6 g· $40–$80 / unit
      99%
      52
      5274.TWO
      信驊
      NT$17,525
      +0.11%