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NVIDIA Vera Rubin / variant

Vera Rubin NVL144 CPX

Prefill-optimized rack with 144 GPUs. 8 EFLOPS, 100 TB fast memory, 1.7 PB/s aggregate memory bandwidth. Paired with NVL72 racks for decode.

Cooling
liquid
Optics
copper
Form factor
rack
TDP
180 kW
Process
TSMC N3P
Launch
2027 H1

出貨量預估

區間 + 信心水準 + 來源；不同分析師、不同時點的預估會並列。

期間出貨量 (low–mid–high)ASP (USD)信心來源
2027 H1500–1.2k–2.0k5.50MrumorInferred from NVIDIA roadmap
2027 FY1.5k–3.0k–5.0k5.30MrumorInferred from NVIDIA roadmap

Server-level BOM

每行 = 單一機台的零組件 slot。share % 是該供應商在此 component 的估計份額。

Compute

GPU / CPU dies — the headline silicon.

2 項零組件
$4.5M–$7.5M
  • Rubin CPX GPU diegating

    Tuned Rubin variant with prefill-tuned compute / memory ratio.

    ×144 die· silicon· 90 g· $30k–$50k / unit
    100%
    100%
  • Vera CPU diegating

    88-core Vera CPU.

    ×72 die· silicon· 50 g· $2.0k–$4.0k / unit
    100%
    100%

Memory

HBM stacks attached to the compute die.

1 項零組件
$806k–$1.3M
  • HBM4 stackgating

    Higher capacity HBM4 for prefill (16-Hi 36-48 GB stacks).

    ×1152 stack· DRAM· 6 g· $700–$1.1k / unit
    60%
    25%
    15%

Packaging & Substrate

Advanced packaging (CoWoS-L) + ABF substrate.

2 項零組件
$36k–$65k
  • CoWoS-L interposergating
    ×144 interposer· silicon· 4 g
    100%
  • ABF substrategating
    ×144 substrate· ABF film· 35 g· $250–$450 / unit
    50%
    30%
    20%

Cooling

Cold plate, CDU, hoses, manifolds.

2 項零組件
$136k–$226k
  • Liquid cold plate (GPU)gating
    ×144 piece· copper· 350 g· $180–$320 / unit
    30%
    25%
    25%
    20%
  • CDU (high-density)gating
    ×1 unit· steel + aluminum· 110.0 kg· $110k–$180k / unit
    60%
    40%

Power

PSUs, busbars, BBU.

1 項零組件
$10k–$17k
  • PSU 8 kWgating
    ×18 unit· 5.8 kg· $550–$950 / unit
    50%

Networking

NICs, switches, cables, CPO modules.

2 項零組件
$223k–$382k
  • NVLink-6 switch traygating
    ×36 unit· 6.5 kg· $4.0k–$7.0k / unit
    100%
  • ConnectX-9 NICgating
    ×144 card· 180 g· $550–$900 / unit
    100%

Chassis & Mechanical

Rack, sleds, trays, brackets, heatsink fins.

1 項零組件
$9k–$16k
  • Rack enclosure (deeper)
    ×1 unit· steel· 220.0 kg· $9.0k–$16k / unit
    50%
    30%

Board / Backplane / BMC

Motherboard, backplane, BMC, signal integrity.

1 項零組件
$40–$80
  • BMC management chip
    ×1 chip· silicon· 6 g· $40–$80 / unit
    95%